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    A review of soldering by localized heating
    Peng Cui, Wanchun Yang, Fei Peng, Wenbo Zhu, Fan Yang, Mingyu Li
    2023, 32(2): 1-15. DOI: 10.12073/j.cw.20230302001
    Abstract FullText HTML PDF
    Research progress of molecular dynamics simulation for nanoparticles
    Jing Han, Teng Li, Xuelun Jin, Yishu Wang, Qiang Jia
    2023, 32(2): 16-22. DOI: 10.12073/j.cw.20230227002
    Abstract FullText HTML PDF
    Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature
    Lizhi Song, Yong Xiao, Bangfu Xi, Jiaqi Li, Jian Zhang
    2023, 32(2): 23-31. DOI: 10.12073/j.cw.20230319001
    Abstract FullText HTML PDF
    Fluxless bonding with silver nanowires aerogel in die-attached interconnection
    Bicheng Fu, Yi Fang, Le Zhang, Daohui Li, Fang Qi, Lijun Song, Wenbo Zhu
    2023, 32(2): 32-41. DOI: 10.12073/j.cw.20230227001
    Abstract FullText HTML PDF
    IMC-skeletons reinforced high-temperature interconnections through low-temperature TLP bonding and micron composite solders
    Xiaoting Wang, Yuyang Zhu, Wenbo Zhu, Mingyu Li
    2023, 32(2): 42-51. DOI: 10.12073/j.cw.20230303001
    Abstract FullText HTML PDF
    Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process
    Xiaowei Wu, Junhong Fu, Shoujing Wei, Hongjie Dong, Jian Wang, Haoran Wang, Xiaoguo Song, Zhuolin Li
    2023, 32(2): 52-62. DOI: 10.12073/j.cw.20230308001
    Abstract FullText HTML PDF