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A review of soldering by localized heating
Peng Cui, Wanchun Yang, Fei Peng, Wenbo Zhu, Fan Yang, Mingyu Li
2023, 32(2): 1-15. DOI: 10.12073/j.cw.20230302001
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Research progress of molecular dynamics simulation for nanoparticles
Jing Han, Teng Li, Xuelun Jin, Yishu Wang, Qiang Jia
2023, 32(2): 16-22. DOI: 10.12073/j.cw.20230227002
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Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature
Lizhi Song, Yong Xiao, Bangfu Xi, Jiaqi Li, Jian Zhang
2023, 32(2): 23-31. DOI: 10.12073/j.cw.20230319001
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Fluxless bonding with silver nanowires aerogel in die-attached interconnection
Bicheng Fu, Yi Fang, Le Zhang, Daohui Li, Fang Qi, Lijun Song, Wenbo Zhu
2023, 32(2): 32-41. DOI: 10.12073/j.cw.20230227001
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IMC-skeletons reinforced high-temperature interconnections through low-temperature TLP bonding and micron composite solders
Xiaoting Wang, Yuyang Zhu, Wenbo Zhu, Mingyu Li
2023, 32(2): 42-51. DOI: 10.12073/j.cw.20230303001
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Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process
Xiaowei Wu, Junhong Fu, Shoujing Wei, Hongjie Dong, Jian Wang, Haoran Wang, Xiaoguo Song, Zhuolin Li
2023, 32(2): 52-62. DOI: 10.12073/j.cw.20230308001
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