Research progress of molecular dynamics simulation for nanoparticles

With the continuous development of high-power electronic devices, the traditional tin-lead brazing materials no longer meet the conditions of use, and sintered nanometal solder paste is promising for a new generation of packaging materials. The mechanism of microstructural changes of nanoparticle sintering during the sintering process has not been well studied at present. Molecular dynamics (MD) simulations can effectively track the diffusion process of metal atoms during the sintering process and help to reveal the dynamic evolution of nanoparticles. This review presents many MD simulations of nanoparticle sintering, including the growth mechanism of nanoparticles, the effect of different sintering parameters on the performance of sintered joints, the connection mechanism between the reinforced phase and nanoparticles and the performance of composite sintered joints. The low temperature and low pressure sintering of nanopaste are still in face of some problems, and MD simulations are very helpful for improving the sintering process and verifying the mechanism of the reinforcing phase.