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Research progress on solder thermal interface materials
Yang Jiang, Guisheng Zou, Chengjie Du, Lei Liu
2022, 31(1): 1-5. DOI: 10.12073/j.cw.20211216001
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Review on failure analysis of interconnections in power devices
Wei Huang, Zhiwen Chen
2022, 31(1): 6-14. DOI: 10.12073/j.cw.20211227001
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Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test
Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma
2022, 31(1): 15-21. DOI: 10.12073/j.cw.20211130001
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Interfacial enhancement of Ag and Cu particles sintering using (111)-oriented nanotwinned Cu as substrate for die-attachment
Rumeng Guo, Yubo Xiao, Yue Gao, Shiqi Zhou, Yang Liu, Zhiquan Liu
2022, 31(1): 22-28. DOI: 10.12073/j.cw.20220101001
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Study on the performance of silver paste sintered sealing joints for hermetic packaging
Liting Lin, Yongfei Zhang, Xin Li
2022, 31(1): 29-36. DOI: 10.12073/j.cw.20211129001
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Drop impact analysis of TSV-based 3D packaging structure by PSO-BP and GA-BP neural networks
Minghui Mao, Jiansong Liu, Mengke Tian, Pengrong Lin, Xu Long
2022, 31(1): 37-46. DOI: 10.12073/j.cw.20211111001
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Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints
Huijun Cao, shiqin Li, Yinggan Zhang, Yichen Zhu, Mingyu Li, Zhihao Zhang
2022, 31(1): 47-59. DOI: 10.12073/j.cw.20211209001
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Effect of surface finish metallization on interfacial bonding behavior of sintered Ag joints
Fan Yang, Weizhen Wu, Jianjun Du, Mingyu Li
2022, 31(1): 60-64. DOI: 10.12073/j.cw.20211130002
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