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    Research progress on solder thermal interface materials
    Yang Jiang, Guisheng Zou, Chengjie Du, Lei Liu
    2022, 31(1): 1-5. DOI: 10.12073/j.cw.20211216001
    Abstract FullText HTML PDF
    Review on failure analysis of interconnections in power devices
    Wei Huang, Zhiwen Chen
    2022, 31(1): 6-14. DOI: 10.12073/j.cw.20211227001
    Abstract FullText HTML PDF
    Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test
    Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma
    2022, 31(1): 15-21. DOI: 10.12073/j.cw.20211130001
    Abstract FullText HTML PDF
    Interfacial enhancement of Ag and Cu particles sintering using (111)-oriented nanotwinned Cu as substrate for die-attachment
    Rumeng Guo, Yubo Xiao, Yue Gao, Shiqi Zhou, Yang Liu, Zhiquan Liu
    2022, 31(1): 22-28. DOI: 10.12073/j.cw.20220101001
    Abstract FullText HTML PDF
    Study on the performance of silver paste sintered sealing joints for hermetic packaging
    Liting Lin, Yongfei Zhang, Xin Li
    2022, 31(1): 29-36. DOI: 10.12073/j.cw.20211129001
    Abstract FullText HTML PDF
    Drop impact analysis of TSV-based 3D packaging structure by PSO-BP and GA-BP neural networks
    Minghui Mao, Jiansong Liu, Mengke Tian, Pengrong Lin, Xu Long
    2022, 31(1): 37-46. DOI: 10.12073/j.cw.20211111001
    Abstract FullText HTML PDF
    Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints
    Huijun Cao, shiqin Li, Yinggan Zhang, Yichen Zhu, Mingyu Li, Zhihao Zhang
    2022, 31(1): 47-59. DOI: 10.12073/j.cw.20211209001
    Abstract FullText HTML PDF
    Effect of surface finish metallization on interfacial bonding behavior of sintered Ag joints
    Fan Yang, Weizhen Wu, Jianjun Du, Mingyu Li
    2022, 31(1): 60-64. DOI: 10.12073/j.cw.20211130002
    Abstract FullText HTML PDF