Low-temperature soldering process of AlN/Cu enhanced by Ti addition

Aluminum Nitride (AlN) ceramics were soldered to Cu substrate using active metallized Sn0.3Ag0.7Cu-x% Ti (wt.%, where x = 2, 4, 6, 8) at 250 ℃. This process yielded a robust and closely integrated metallized layer on the AlN ceramic’s surface. Employing SnAgCu solder paste within an air atmosphere, joints were formed for durations of 60s and 300 s. Through meticulous microscopic analysis, optimal metallization parameters were identified, resulting in the successful connection between metallized AlN ceramics and Cu substrate at a low temperature. The microstructure interface investigation further elucidated the impact of connection time on the low-temperature soldered joint of metallized AlN ceramics.