Identification and evolution of interfacial structure of SiO₂ glass ceramic/Ti-6Al-4V alloy joint bonded with AgCu/Ni interlayer

AgCu/Ni composite interlayer was utilized to join SiO₂ glass ceramic（74. 52%SiO₂-23. 40%Al₂O₃-2. 0S%K₂O,wt. %） and Ti-6Al-4V alloy by eutectic reaction. Interface structures of the joints were identified by means ofTEM analysis. This joining method contains three characteristic processes,which are the melting of AgCu eutectic alloy,eutectic reaction between interlayer and Ti-6Al-4V base material and active reaction of element Ti to SiO₂ glass ceramic. It is different from traditional active brazing because active element Ti totally dissolves from Ti-6Al-4V and reacts with SiO₂ glass ceramic. SiO₂glass ceramic can be joined successfully to TI-6Al-AV alloy by this novel bonding method and the joint exhibits high shear strength,up to 110 MPa.