FEM simulation on residual stress distribution during diffusion bonding between Ti（C,N） metallic ceramic/interlayer/40Cr steel

Based on ANSYS FEM software,the distribution of residual stress in the diffusion bonding joints between Ti（C,N）metallic ceramic/interlayer/40 Cr steel was calculated and experimentally verified. The results showed that the trend on the distribution of residual stress field in the joints was not changed with the use of interlayer. The maximum residual stress was always located in metallic ceramic with area ranging from 1 mm to 4 mm to the interlayer. The maximum residual stress in the joints was also affected by diffusion temperature. The satellite pulse current during the initial stage on diffusion bonding can promote the formation of liquid film at the interface,by which diffusion temperature and loading pressure can be greatly decreased. The crack initiation was easily produced at the comer of Ti（C,N） metallic ceramic close to the interlayer. If a higher residual stress produced in the joints,the crack was propagated into the whole ceramic.